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2. A package with a heat sink and fan has a thermal resistance to the ambient of 8 °C/W. The thermal resistance from the die to the package is 2 °C/W. If the package is in a chassis that will never exceed 50 °C and the maximum acceptable die temperature is 110 °C, how much power can the chip dissipate?

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To solve this problem it is necessary to apply the concepts related to the Power depending on the temperature and the heat transferred.

By definition the power can be expressed as

[tex]P = \frac{\Delta T}{\Delta Q}[/tex]

Where,

[tex]\Delta T = T_m - T_a =[/tex] Change at the temperature, i.e, the maximum acceptable die temperature ([tex]T_m[/tex]) with the allowable temperature in chassis ([tex]T_A[/tex])

[tex]\Delta Q = Q_A-Q_D =[/tex] Change in the thermal resistance to ambient ([tex]Q_A[/tex]) and the Thermal resistance from die to package ([tex]Q_D[/tex])

Our values are given as,

[tex]T_m=110\°C[/tex]

[tex]T_a= 50\°C[/tex]

[tex]Q_A= 8\°C/W[/tex]

[tex]Q_D= 2\°C/W[/tex]

Replacing we have,

[tex]P = \frac{110-50}{8-2}[/tex]

[tex]P = 10W[/tex]

The power that can dissipate the chip is 10W

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